PCB Fabrication Process Engineer

THE ROLE:

We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners.

THE PERSON:

As a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.

KEY RESPONSIBILITIES:

• Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU PlatformPCBs

• Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & deriskon-schedule delivery of critical builds

• Owntheprocess qualification & adoption of PCBfabricationtechnologiesrequiredtoaddressrapidly evolvingSignal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications

• Define technologyroadmaps, vendor engagements,andhelp implementrobustarchitecturedesign practices forperformance, cost, and manufacturability

• Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams toenablePCB solutions from package to system level

• Contribute to overallPlatformquality from conceptualization/feasibility planningstage through NPI & mass volume productionramp

• Drive process improvements while executing fast time-to-market product delivery

• Function decisivelyin a dynamic&fast-paced product development environment

PREFERRED EXPERIENCE:

• Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use

• Expertise in destructive and non-destructivePCBfailure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy

• Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations

• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development

• Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion

• Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis

• PCB Manufacturing - Sound knowledge of design & fabrication guidelines,in-depth understanding ofPCBA-related failuremechanisms including CAF,PTH/viacracking,pad cratering/solder ball stress,glass-stop &delaminationriskandprovenexperience with volume manufacturingsuppliersin Asia&North America

ACADEMIC CREDENTIALS:

• Required -Bachelor's degree in Engineering(Electrical/Computer/Mechanical/Chemical...etc.)

• Preferred -Master's degree in Electrical/Electronics & Computer Engineering