PIC Design Engineer - Technical Lead - Acacia

Acacia Communications designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.

Application window is expected to close on September 30th, 2024

As a member of the Photonic Integrated Circuits (PIC) team, you will be a key member of a small, dynamic group that develops advanced photonics chips for optical communications products. You will design, simulate, layout and test PIC's.

You will design, and numerically model passive, and active photonic components with tools such as FDTD, HFSS and COMSOL. You will also perform script-based GDS layout of photonic components, circuits and full product chips.

You will work very closely with the entire PIC team covering a wide variety of directions, including silicon photonics and III-V device designs, simulation, foundry process development, production tapeouts, PIC testing, and production support. You will also work closely with millimeter wave design team, packaging team, and module hardware / software / optics testing team in building complete products.

Acacia takes pride in providing and fostering a collaborate environment to ensure success and personal growth.

You have deep knowledge of PIC design, simulation, layout, fabrication, and testing needed for pioneering high-volume products. This includes hands on knowledge of optical waveguides, modulators, photodetectors, and other passive & active optical components.

You are enthusiastic about engineering and seeing your effort contribute to a great product in real world applications. You are detail oriented, with high energy and the drive to get things done while solving difficult problems. You are capable of independent problem solving, but you appreciate a friendly, team-oriented, collaborative work environment, which means you enjoy learning from your colleagues and letting them learn from you. You are not shy to always point out how we can be more effective as a team, and you are open to similar suggestions by your team members. Your great interpersonal and communication skills allow effortless collaboration within and across teams and to steer the development in a positive direction.

• Ph.D. with 5+ years of experience or master's degree with 10+ years of industry experience or equivalent in optical engineering, physics, electrical engineering.
• 5+ years of photonic IC design experience in industry.
• 5+ years of experience with photonics numerical simulation principle and tools.
• 5+ years of script-based component GDS layout and tapeout.
• 5+ years of experience in photonic component testing.

• Experience with GDS level mask data for device fabrication
• Experience with high-speed probing
• Prior interaction with wafer foundries to optimize PIC designs and associated fabrication techniques

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